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软板 & 软硬结合板 & HDI & 多层板

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IC封装载板

车载摄像头

COB

电声类

无线充电

工控医疗

指纹FPC

IC卡

MiniLED

HDI

多层板

其他

Product Picture	Product Parameter	Mass Run	Sample
	Material	FR-4	FR-4
	Max. Layer count	2	4
	Min Board Thickness	0.1mm	0.1mm
	Hole Copper Thickness	12-25μm	12-25μm
	Min. Hole size	Laser：100μm	Laser：80μm
	Min. Hole size	Mechanical：0.15mm	Mechanical：0.1mm
	Min. Conductor Width/Spacing	50/50μm	50/50μm
	Aspect ratio	≤4:1	≤6:1
	Max. set size	200*300mm	250*400mm
	Finished surface	ENIG、ENEPIG
	Special Technology	POFV

Product Picture	Product Parameter	R-Mass Run	R-FPC Sample
	Material	PI/PI+FR4	PI/PI+FR4
	Max. Layer count	6	8
	Board Thickness	0.4-2.5mm	0.3-3.0mm
	Hole Copper Thickness.	18-25μm	18-25μm
	Min. Hole size	Laser：100μm	Laser：80μm
	Min. Hole size	MC：0.15mm	MC：0.15mm
	Min. Conductor Width/Spacing	75/75μm	50/50μm
	Aspect ratio	≤8:1	≤10:1
	Max. set size	120*250mm	120*250mm
	Finished surface	ENIG
	Special Technology	POFV

Product Picture	COB Product Parameter	Mass Run	Sample
	Material	FR4+PI（PP+PI）	FR4+PI（PP+PI）
	Max. Layer count	4-6	6
	Board Thickness	0.3-0.5mm	0.3-0.5mm
	Copper Thickness.	15-35um	15-35um
	Min. Hole size	laser：75μm	laser：75μm
	Min. Hole size	MC：0.1mm	MC：0.1mm
	Min. Conductor Width/Spacing	50μm/50μm	50μm/50μm
	Aspect ratio	6：1	8：1
	Max. set size	120*200	120*200
	Finished surface	ENEPIG
	Special Technology	ENEPIG, high requirement on bonding pad size and flatness, can achieve any layer HDI FVSS(free via stacked up structure).

Product Picture	Product Parameter	R-Mass Run	R-FPC Sample
	Material	FR4+PI（PP+PI）	FR4+PI（PP+PI）
	Max. Layer count	6	8
	Board Thickness	0.3-0.5mm	0.3-0.5mm
	Hole Copper Thickness.	15-35μm	15-35μm
	Min. Hole size	Laser：100μm	Laser：80μm
	Min. Hole size	MC：0.1mm	MC：0.1mm
	Min. Conductor Width/Spacing	50/50μm	40/50μm
	Aspect ratio	≤8:1	≤10:1
	Max. set size	120*120mm	120*200mm
	Finished surface	ENIG/ENEPIG
	Special Technology	ENEPIG, high requirement on bonding pad size and flatness, can achieve any layer HDI&FVSS(free via stacked up structure)

Product Picture	Wireless charging Product Parameter	Mass Run	Sample
	Material	PI	PI
	Max. Layer count	2	4
	Board Thickness	0.2mm	0.5mm
	Hole Copper Thickness.	10-15μm	10-15μm
	Min. Hole size	Laser：100μm	Laser：80μm
	Min. Hole size	Mechanical：0.15mm	Mechanical：0.15mm
	Min. Conductor Width/Spacing	100/100μm	75/75μm
	Aspect ratio	1：1	1：1
	Max. set size	230*400mm	230*500mm
	Finished surface	ENIG+Golden Finger
	Special Technology	Double finished surface (ENIG + heavy gold)

Product Picture	Product Parameter	Mass Run	Sample
	Material	FR4/PI	FR4/PI
	Max. Layer count	8	14
	Max Board Thickness	1.6mm	3.0mm
	Hole Copper Thickness.	18-25μm	18-25μm
	Min. Hole size	Laser：100μm	Laser：80μm
	Min. Hole size	Mechanical：0.15mm	Mechanical：0.15mm
	Min. Conductor Width/Spacing	100/100μm	75/75μm
	Aspect ratio	≤8:1	≤10:1
	Max. set size	230*400mm	230*500mm
	Finished surface	ENIG, OSP, ENIG+OSP, Golden Finger, ENEPIG
	Special Technology	POFV、ELIC,

Product Picture	Product Parameter	R-Mass Run	R-FPC Sample
	Material	PI	PI
	Max. Layer count	2	4
	Board Thickness	0.1mm	0.5mm
	Hole Copper Thickness.	10-15μm	10-15μm
	Min. Hole size	Laser：100μm	Laser：80μm
	Min. Hole size	Mechanical：0.1mm	Mechanical：0.1mm
	Min. Conductor Width/Spacing	50/50μm	50/50μm
	Aspect ratio	1:1	1:1
	Max. set size	120*200mm	120*200mm
	Finished surface	ENIG
	Special Technology	High requirements on flatness, especially on drive IC area; high grounding resistance required.

Product Picture	IC Card Product Parameter	Mass Run	Sample
	Material	FR4/PI	FR4/PI
	Max. Layer count	2	4
	Min Board Thickness	0.15mm	0.1mm
	Max. Surface Copper Thickness.	35μm	70μm
	Min. Hole size	Laser：100μm	Laser：80μm
	Min. Hole size	Mechanical：0.15mm	Mechanical：0.1mm
	Min. Conductor Width/Spacing	0.1/0.1mm	0.075/0.075mm
	Aspect ratio	1：1	2：1
	Max. set size	230*400mm	230*500mm
	Finished surface	ENIG/ENEPIG
	Special Technology

Product Picture	Product Parameter	R-Mass Run	R-FPC Sample
	Material	FR4/BT	FR4/BT
	Max. Layer count	4	8
	Min Board Thickness	0.2mm	0.1mm
	Hole Copper Thickness.	12-25μm	12-25μm
	Min. Hole size	Laser：100μm	Laser：80μm
	Min. Hole size	Mechanical：0.1mm	Mechanical：0.1mm
	Min. Conductor Width/Spacing	0.075/0.075mm	0.075/0.075mm
	Aspect ratio	4：1	6：1
	Max. set size	250*500mm	300*650mm
	Finished surface	ENIG/ENEPIG/OSP
	Special Technology

Product Picture	Product Parameter	R-Mass Run	R-FPC Sample
	Material	FR4	Resin material
	Max. Layer count	8L	16L
	Board Thickness	≤3.0mm	≤4.0mm
	Copper Thickness.	15-60μm	15-100μm
	Hole copper thickness	12-25um	12-25um
	Min. Hole size	Laser hole ：Φ0.1mm	Laser hole ：Φ0.1mm
	Min. Hole size	Mechanical Hole：Φ0.2mm	Mechanical Hole：Φ0.1mm
	Min. ConductorWidth/Spacing	50μm/50μm	40μm/40μm
	Aspect ratio	≤1：1	≤1：1
	Max. set size	520mm*600mm	520mm*600mm
	Finished surface	ENIG、OSP、OSP+ENIG、Immersion Tin、Immersion Ag、 Plating Au/Ni、Golden finger
	Special Technology	Counterbore, Backdrill, Step slots,Plated board edge, PTH Half-holes, POFV

Product Picture	Product Parameter	R-Mass Run	R-FPC Sample
	Material	FR4	FR4
	Max. Layer count	10	16
	Board Thickness	0.1-3.0mm	0.1-4.0mm
	Copper Thickness.	12-100μm	12-100μm
	Min. hole size	Mechanical：0.1mm	Mechanical：0.1mm
	Min. Conductor Width/Spacing	50/50μm	40/40μm
	Aspect ratio	≤8:1	≤10:1
	Max. set size	520*600mm	520*600mm
	Finished surface	ENIG、OSP、ENIG+OSP、Immersion Tin、Immersion Ag、 Plating Au/Ni
	Special Technology	Counterbore, Backdrill, Step slots, Plated board edge, PTH Half-holes, VIP

笔电摄像头

笔电摄像头

镭槽

ENIG+镀金手指

ENIG+镀金手指

美背封装载板

美背封装载板

薄硬板

薄硬板

PLCC

PLCC

PLCC

PLCC

FPC

FPC

R-FPC

R-FPC

FPC

FPC

BGA半孔封装板

BGA半孔封装板

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